Silicon Wafer Level Packaging Assemblies

Wafer-level jar packaging asemblies

Silicon wafer-level packaging systems for storing and shipping integrated circuits for the semiconductor industry for 75mm 100mm 150mm 200mm 300mm and even square solar solutions. Plastic packaging jars antistatic and conductive foam liners cushions, and tyvek and carbon leaf interleave separators.  Deep natural color jars and lids use pink anti static foam liners and open cell foam disc separators along with tyvek paper and blackstat discs. Silicon wafer packaging for the electronics semiconductor industry
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75mm (3”) 100mm (4”) 125mm (5”) 150mm (6”) 200mm (8”) 300mm (12”) wafers

Wafer-level protective packaging method

Types of wafer sheet separators filter paper tyvek discs and black stat conductive paper

 

75mm 3" wafer-level packaging storage shipping system

75mm 3" Wafer Jar Packaging Jars and Assemblies Anti Static Foam Liners Interleave Separators
Tyvek
Black Conductive Foam
Pink Anti Static Foam

75mm (3”) Wafer Packaging Jars and Assemblies

MC-316JLL The MC-416 Jar, Lid and MC-316ASL Liner

MC-324JLL The MC-424 Jar, Lid and MC-324ASL Liner

Anti-static Foam Liners

MC-316ASL Anti-static Open-cell Foam Liner, Adapts the MC-416 Jar to have a 3” Diameter

MC-324ASL Anti-static Open-cell Foam Liner, adapts the MC-424 Jar to have a 3” Diameter

Separators

MC-3AFD 3” Diameter x 0.25” thick Anti-static Open-cell Foam Disc

MC-3AFDF 3” Diameter x 0.25” thick Anti-static Closed-cell Foam Disc

MC-3FP 3” Diameter Filter Paper Separator

MC-3TD 3” Diameter Tyvek Separator

MC-3BLAC 3” Diameter BlacStat Separator


100mm 4" wafer-level packaging plastic jars and assembly with interleave separators

100mm Complete Wafer Jar Assembly for 4" Wafers with 2.25" Deep (Closed-Cell Polyethylene Liner)
Assembly Components:
MC-416JL Wafer Jar and Lid 2.25" deep
MC-416ASL Foam Liner Anti-static Pink Closed-Cell Polyethylene. Density: 2.2 PFC Min
MC-400AFDF Foam Disc Cushions
MC-400TD White Tyvek Separators

Complete Wafer Jar Assembly for 4" Wafers with 3.0" Deep (Closed-Cell Polyethylene Liner)

Assembly Components:
MC-424JL Wafer Jar and Lid
MC-424ASL Foam Liner
MC-400AFDF Foam Disc Cushions
MC-400TD Tyvek Separators


125mm 5" inch wafer-level packaging with antistatic foam liner and and paper spearators


150mm 6" inch wafer storage shipping packing parts and diagram with open-cell and closed-cell foam discs.

150MM 6" WAFER PACKAGING Silicon wafer packaging for the semiconductor industry

MC-210SW Complete Wafer Jar Assembly for 210mm x 210mm Square Wafers
2.6" Deep (Open-Cell Polyurethane Liner)
Assembly for 210mm x 210mm square wafers assembly components include:

  • MC-300JL (Qty: 1) Wafer Jar and Lid
  • MC-210ASL (Qty: 1) A/S Foam Liner
  • MC-MC-210AFD-SQ (Qty: 10) Foam Disc Cushions
  • MC-MC-210TD-SQ (Qty: 12) Tyvek Separators

200mm 8" inch silicon wafer-level packaging packing supplies and materials with antistatic pink foam cushioning liners disc interleave separators tyvek black papers and plastic jars with lids

300mm 12" Silicon wafer-level packaging system plastic case jar with lid pink antistatic foam cushioning inserts white tyvek paper discs seperators

12" wafer packs and holders. Use insert separators for sensitive semiconductor circuit packaging.


Square wafer packaging jar and lid with pink antistatic die cut foam insert for fit

Square wafer packaging jar and lid with pink antistatic die cut foam insert for fit

Square silicon wafer assembly use plastic jars and have die cut foam inserts and interleave separators to fit:
100mm x 100mm
125mm x 125mm
150mm x 150mm
210mm x 210mm
example: MC-210SW JarAssembly for 210mm x 210mm Square Wafers
2.6" Deep (Open-Cell Polyurethane Liner
Assembly for 210mm x 210mm Square Wafers
Assembly Components:

  • MC-300JL (Qty: 1) Wafer Jar and Lid
  • MC-210ASL (Qty: 1) A/S Foam Liner
  • MC-MC-210AFD-SQ (Qty: 10) Foam Disc Cushions
  • MC-MC-210TD-SQ (Qty: 12) Tyvek Separators

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